Products with Xilinx FPGA

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Products with Xilinx FPGA

CR00140｜Xilinx Zynq-7000

CR00140-Motor Control Development Kit with Xilinx Zynq UltraScale+ ZU2CG-1E MPSoC Module

The Trenz Electronic motor control development kit CR00140-02-K0B includes a CRUVI motor driver module CR00140-02, a carrier board TEB0707-02 and a TE0820-04-2AE21MA module with Xilinx Zynq UltraScale+ including a heat sink. Supplied with a universal plug-in power supply with four adapters, a DC motor including cable for CRUVI CR00140 and an 8 GB micro SD card.

The Module: CR00140-02

The Trenz Electronic CR00140 is a CRUVI motor driver module. It supports motors with up to 4 phases up to 40V. 

Key Features

  • On Board
    • MAX 10 CPLD
    • 2 phase current measurement
    • DC_LINK voltage measurement
    • 4 x LEDs (2 power indicator, 2 user)
    • 2 x Pushbutton
  • Interface
    • 4 phase screw terminal motor connector
    • CRUVI for control
      • 1 x high speed connector
    • 6 x 1 pin header for single ended sensors
    • 5 x 2 pin header for differential sensors
  • Power
    • Screw terminal for up to 40V DC motor supply
  • Dimension
    • 68.35 mm x 131 mm

Key Features

  • Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
    • 784 Pin Packages
    • Application Processor: Dual-core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Four high-speed serial I/O (HSSIO) interfaces (PS GTR transceivers) supporting following protocols: (not usable on TEB0707)
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface

      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 132 x HP PL I/Os (3 banks)
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
  • Rugged for shock and high vibration
  • Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (regular 4 mm)
  • 2 GByte DDR4 SDRAM, 32-Bit databus-width
  • 128 MByte QSPI boot Flash in dual parallel mode
  • 8 GByte e.MMC Memory (up to 64 GByte)
  • Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
  • Gigabit Ethernet transceiver PHY
  • MAC address serial EEPROM with EUI-48 node identity
  • Hi-speed USB2 ULPI transceiver with full OTG support
  • All power supplies on board
  • Evenly spread supply pins for good signal integrity
  • 4 x 5 cm form factor

Key Features

Modules

  • 4 x 5 Trenz Electronic modules

RAM/Storage

  • EEPROM (FTDI configuration)

On Board

  • Intel MAX 10 FPGA
  • FTDI FT2223
  • 6 x user LEDs (3 x green, 3 x red)
  • 2 x status LEDs
  • DIP switch
  • Push buttons

Scope of Delivery CR00140-02-K0B Motor Control Development Kit

  • 1 x CR00140-02 CRUVI Motor Driver Module
  • 1 x TE0820-04-2AE21MA MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E
  • 1 x TEB0707-02 Carrierboard für Trenz Electronic 4 x 5 Modul-Carrier für CRUVI Erweiterungsboards
  • 1 x Pre-installed heatsink for TE0820
  • 1 x BLY172D-24V-4000-1250SI Brushless DC Motor from Anaheim Automation
    • Rated Voltage 24V
    • Rated Speed 4000rpm
    • Rated Power 53W
    • Including encoder, 1250 count per rev, index function (single ended connection)
  • 1 x Universal plug power supply with 4 adapters
  • 1 x 8 GB Class 4 microSDHC-Card
  • 1 x Cable for CR00140
20171115 04

產品編號：

CR00140-02-K0B：Motor Control Development Kit with Xilinx Zynq UltraScale+ ZU2CG-1E MPSoC Module

CR00140-02-K1B：Motor Control Development Kit with Xilinx Zynq 7020-1C SoC Module
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Products with Xilinx FPGA

TE0783｜ Xilinx Zynq Z-7045

TE0783－High-Performance SoM with Xilinx Zynq Z-7045, Memory on both PS+PL, 8.5 x 8.5

The Trenz Electronic TE0783 is a high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC (XC7Z045) with 1 GByte (32-bit) DDR3 RAM connected to PS, 2 GByte (64-bit) DDR3 RAM connected to PL, 4 GByte e.MMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. 

2022 10 31 132723

Features

  • Xilinx Zynq-7000 XC7Z045-2FFG900I SoC
  • Rugged for shock and high vibration
  • Large number of configurable I/Os are provided via rugged high-speed stacking strips
  • Dual ARM Cortex-A9 MPCore
    • 1 GByte (32-bit) DDR3 RAM connected to PS
    • 2 GByte (64-bit) DDR3 RAM connected to PL
    • 32 MByte QSPI Flash memory
    • Hi-Speed USB 2.0 ULPI transceiver PHY
    • Gigabit (10/100/1000 Mbps) Ethernet transceiver PHY
    • 4 GByte e.MMC (optional up to 64 GByte)
  • Lattice MachXO2 HC 4000 System Controller CPLD
    • 40 GPIO's available to user on B2B connector
  • MAC-address EEPROM
  • Serial user EEPROM
  • Temperature compensated RTC (real-time clock)
  • Si5338A programmable quad PLL clock generator for GTX transceiver clocks
  • Plug-on module with 3 x 160-pin high-speed strips
    • 16 GTX high-performance transceiver
    • 4 x GT transceiver clock inputs
    • 166 FPGA I/O's (83 LVDS pairs)
  • On-board high-efficiency switch-mode DC-DC converters
  • System management
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
  • Evenly-spread supply pins for good signal integrity
  • User LED

Scope of Delivery

  • 1 x TE0783-02-92I33MA Trenz Electronic SoM with Xilinx Zynq-7045 FPGA
20171115 04

  產品編號：TE0783-02-92I33MA
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Products with Xilinx FPGA

TEC0850｜ Xilinx Zynq UltraScale+ ZU15, 3U form factor

TEC0850－CompactPCI Serial Card with Xilinx Zynq UltraScale+ ZU15, 3U form factor

The Trenz Electronic TEC0850 board is a CompactPCI Serial card (3U form factor) integrating a Xilinx Zynq UltraScale+ MPSoC ZU15EG, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, 128 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors.

2022 10 31 133443

Key Features

  • Xilinx Zynq UltraScale+ XCZU15EG-1FFVB1156E
  • ZU15EG, 1156 Pin Packages
  • Dimensions: 3U, 8HP CompactPCI-Serial
  • Rugged for shock and high vibration.
  • Front side interface connectors
    • RJ-45 GbE Ethernet interface
    • Circular push/pull connector with 4x on-board 8bit DAC output
    • MicroSD Card connector
    • USB 2.0 and USB 3.0 to FIFO bridge connector
    • 4x status LEDs
  • 4 CompactPCI Serial connectors for backplane connection (3U form factor)
    • 24 GTH lanes
    • 4 PS GTR lanes
    • USB 2.0 interface
    • 64 Zynq PL HP I/O's
    • 8x PLL clock input
    • JTAG, I²C and 7 user I/O's to MAX10 FPGA
  • 8 GByte (up to 32 GByte possible configuration) DDR4 SODIMM, 64-bit width, support DDR4 SODIMM with ECC
  • 128 MByte dual parallel QSPI Flash (bootable), 512 MByte maximum
  • 26-pin header with 20 Zynq PL HD I/O's
  • 3-pin header with 2 MAX10 FPGA I/O's
  • System Controller (Altera MAX10 FPGA SoC)
    • Power Sequencing
    • System management and control for MPSoC and onboard peripherals
  • Si5345 programmable 10 output PLL clock generator
  • Si53340 Quad clock buffer
  • 1x user push button
  • Zynq MPSoC cooling FAN connector
  • On-board high-efficiency DC-DC converters
  • Evenly spread supply pins for good signal integrity.

Scope of Delivery

  • 1 x TEC0850-03-BBEX1-A Trenz Electronic CompactPCI Serial Card with Xilinx Zynq UltraScale+ ZU15EG
20171115 04

  產品編號：TEC0850-03-BBEX1-A
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Products with Xilinx FPGA

TE0802｜ Xilinx Zynq UltraScale+

TE0802－MPSoC Development Board with Xilinx Zynq UltraScale+

The Trenz Electronic TE0802 is a development board integrating a Xilinx Zynq UltraScale+. Other assembly options for the FPGA and the memory chips are available.

．Xilinx Zynq UltraScale+ ZU2,1 GB

．Xilinx Zynq UltraScale+ ZU1,1 GB

2022 10 31 133034

Key Features

  • Xilinx Zynq UltraScale+ XCZU2CG-1SBVA484E
  • Storage
    • 1 GByte LPDDR4
    • 32 MByte SPI Flash
    • MicroSD card
    • M2 PCIe SSD support
  • Display
    • DisplayPort
    • VGA
    • 4-digit 7-segment LED
    • 8 LEDs
  • Audio: 3.5 mm jack
  • 2 x Pmod connectors
  • Communication and Debug
    • USB 3.0 Host (type A connector)
    • USB JTAG/UART Micro-USB
    • Gigabit Ethernet RJ45
  • Input
    • 5 push buttons
    • 8 bit slide switches
    • Reset button
  • EEPROM
  • Power supply: 5V plug
  • Size: 100 mm × 100 mm. Please download the assembly diagram for exact numbers.

Scope of Delivery

  • 1 x TE0802-02-2AEV2-A MPSoC development board with Xilinx Zynq UltraScale+
20171115 04

  產品編號：

TE0802-02-2AEV2-A-TE0802｜ Xilinx Zynq UltraScale+ ZU2,1 GB

TE0802-02-1AEV2-A-TE0802｜ Xilinx Zynq UltraScale+ ZU1,1 GB
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TEC0330｜ Xilinx Virtex-7 FPGA, 8 Lane PCIe GEN2, SODIMM SDRAM

TEC0330－PCIe FMC Carrier with Xilinx Virtex-7 FPGA, 8 Lane PCIe GEN2, SODIMM SDRAM

The Trenz Electronic TEC0330 is a PCI Express form factor card (PCIe 2.0 or higher) integrating the Xilinx Virtex-7 XC7VX330T FPGA chip. This high-end FPGA card is designed for maximum system performance and intended for use in applications with high demands on system throughput. There is a SO-DIMM socket on the board for standard DDR3 SDRAM extension memory module.

The TEC0330 features HPC (High Pin Count) ANSI/VITA 57.1 compatible FMC interface connector for standard I/O Mezzanine modules. Other interface connectors found on-board include JTAG for accessing FPGA and on-board System Controller CPLD, and also connector with 5 high-speed I/O differential signaling pairs.

2022 10 31 133724

Key Features

  • Xilinx Virtex-7 FPGA module XC7VX330T-2FFG1157C (commercial temperature range)
  • PCI Express 2.0 x8 card with maximum throughput of 4 GB/s
  • FMC High Pin Count (HPC) connector
  • 8 FPGA MGT lanes available on PCIe interface
  • DDR3 SODIMM SDRAM socket
  • 256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
    • FPGA
    • JTAG port (SPI indirect, bus width x4)
  • External clock input via SMA coaxial connector
  • 28 GTH transceivers, each with up to 13.1 Gbit/s data transmission rate
  • FPGA configuration through:
    • JTAG connector
    • SPI Flash memory
  • Programmable quad clock generator
  • TI LMK04828B ultra low-noise JESD204B compliant clock jitter cleaner
  • On-board high-efficiency DC-DC converters
  • Up to 202 FPGA I/O pins available on FMC connector (up to 101 LVDS pairs possible)
  • System management and power sequencing
  • AES bit-stream encryption
  • eFUSE bit-stream encryption

Scope of Delivery

  • 1 x TEC0330-05 Trenz Electronic PCIe FMC Carrier with Xilinx Virtex-7 330T FPGA
20171115 04

  產品編號：TEC0330-05
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  1. TEF1001｜ PCIe FMC Carrier ｜Xilinx Kintex-7 (160T/325T/410T)
  2. TEF1002｜PCIe FMC Carrier
  3. TEB0912｜Xilinx Zynq UltraScale+
  4. TEB0911｜ UltraRack+ Board｜Xilinx Zynq UltraScale+

和澄科技 Haley Technology

電話 │ 886-3-5790380
傳真 │ 886-3-5790370
信箱 │ sales@haleytech.com
地址 │ 新竹市關新路27號18樓之2

               

 

 

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