TE0823－MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP

The Trenz Electronic TE0823-01-3PIU1ML is an industrial-grade MPSoC module integrating a low power Xilinx Zynq UltraScale+ ZU3CG, 1 GByte LPDDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

Key Features

General

• Rugged for shock and high vibration
• Evenly spread supply pins for good signal integrity
• Plug-on module with 2 x 100 pin and 1 x 60 pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (low profile, 2,5 mm)

SoC/FPGA

• Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I (Low Power)
  • Application Processor: Dual-core ARM Cortex-A53 MPCore
  • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
• Package: SFVC784
• Device: ZU3
• Engine: CG
• Speed: -1LI (also non-low power assembly options possible)
• Temperature range: industrial

RAM/Storage

• Low power DDR4 on PS with 32 bit data width
• 128 MByte QSPI boot Flash in dual parallel mode
• 8 GByte e.MMC memory with 8 bit data width
• MAC address serial EEPROM with EUI-48 node identity

On Board

• Lattice LCMXO2
• PLL SI5338
• Gigabit Ethernet transceiver PHY
• Hi-speed USB2 ULPI transceiver with full OTG support

Interface

• 132 x HP PL I/Os (3 banks)
• ETH
• USB
• 4 GTR (for USB3, SATA, PCIe, DP)
  Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
  • PCI Express interface version 2.1 compliant
  • SATA 3.1 specification compliant interface

  • DisplayPort source-only interface with video resolution up to 4k x 2k

  • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
  • 1 GB/s serial GMII interface
• 14 x PS MIOs
  • MIO for UART
  • thereof 6 MIO for SD card interface (default configuration)
  • MIO for PJTAG
• JTAG
• Ctrl

Power

• 3.3V-5V main input
• 3.3V controller input
• Variable bank I/O power input
• All power supplies on board

Dimension

• 4 x 5 cm form factor

Scope of Delivery

• 1 x TE0823-01-3PIU1ML Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU3CG (low power) and low profile socket strips

	產品編號：TE0823-01-3PIU1ML
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