Products with Xilinx FPGA

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Products with Xilinx FPGA

CR00140｜Xilinx Zynq-7000

CR00140-Motor Control Development Kit with Xilinx Zynq UltraScale+ ZU2CG-1E MPSoC Module

The Trenz Electronic motor control development kit CR00140-02-K0B includes a CRUVI motor driver module CR00140-02, a carrier board TEB0707-02 and a TE0820-04-2AE21MA module with Xilinx Zynq UltraScale+ including a heat sink. Supplied with a universal plug-in power supply with four adapters, a DC motor including cable for CRUVI CR00140 and an 8 GB micro SD card.

The Module: CR00140-02

The Trenz Electronic CR00140 is a CRUVI motor driver module. It supports motors with up to 4 phases up to 40V. 

Key Features

  • On Board
    • MAX 10 CPLD
    • 2 phase current measurement
    • DC_LINK voltage measurement
    • 4 x LEDs (2 power indicator, 2 user)
    • 2 x Pushbutton
  • Interface
    • 4 phase screw terminal motor connector
    • CRUVI for control
      • 1 x high speed connector
    • 6 x 1 pin header for single ended sensors
    • 5 x 2 pin header for differential sensors
  • Power
    • Screw terminal for up to 40V DC motor supply
  • Dimension
    • 68.35 mm x 131 mm

Key Features

  • Xilinx Zynq UltraScale+ XCZU2CG-1SFVC784E
    • 784 Pin Packages
    • Application Processor: Dual-core ARM Cortex-A53 MPCore
    • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
    • Four high-speed serial I/O (HSSIO) interfaces (PS GTR transceivers) supporting following protocols: (not usable on TEB0707)
      • PCI Express interface version 2.1 compliant
      • SATA 3.1 specification compliant interface

      • DisplayPort source-only interface with video resolution up to 4k x 2k

      • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
      • 1 GB/s serial GMII interface
    • 132 x HP PL I/Os (3 banks)
    • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
  • Rugged for shock and high vibration
  • Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (regular 4 mm)
  • 2 GByte DDR4 SDRAM, 32-Bit databus-width
  • 128 MByte QSPI boot Flash in dual parallel mode
  • 8 GByte e.MMC Memory (up to 64 GByte)
  • Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
  • Gigabit Ethernet transceiver PHY
  • MAC address serial EEPROM with EUI-48 node identity
  • Hi-speed USB2 ULPI transceiver with full OTG support
  • All power supplies on board
  • Evenly spread supply pins for good signal integrity
  • 4 x 5 cm form factor

Key Features

Modules

  • 4 x 5 Trenz Electronic modules

RAM/Storage

  • EEPROM (FTDI configuration)

On Board

  • Intel MAX 10 FPGA
  • FTDI FT2223
  • 6 x user LEDs (3 x green, 3 x red)
  • 2 x status LEDs
  • DIP switch
  • Push buttons

Scope of Delivery CR00140-02-K0B Motor Control Development Kit

  • 1 x CR00140-02 CRUVI Motor Driver Module
  • 1 x TE0820-04-2AE21MA MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E
  • 1 x TEB0707-02 Carrierboard für Trenz Electronic 4 x 5 Modul-Carrier für CRUVI Erweiterungsboards
  • 1 x Pre-installed heatsink for TE0820
  • 1 x BLY172D-24V-4000-1250SI Brushless DC Motor from Anaheim Automation
    • Rated Voltage 24V
    • Rated Speed 4000rpm
    • Rated Power 53W
    • Including encoder, 1250 count per rev, index function (single ended connection)
  • 1 x Universal plug power supply with 4 adapters
  • 1 x 8 GB Class 4 microSDHC-Card
  • 1 x Cable for CR00140
20171115 04

產品編號：

CR00140-02-K0B：Motor Control Development Kit with Xilinx Zynq UltraScale+ ZU2CG-1E MPSoC Module

CR00140-02-K1B：Motor Control Development Kit with Xilinx Zynq 7020-1C SoC Module
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Products with Xilinx FPGA

TEB0911｜ UltraRack+ Board｜Xilinx Zynq UltraScale+

TEB0911－UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC Connectors

The Trenz Electronic TEB0911 UltraRack+ board is integrating a Xilinx Zynq UltraScale+ ZU9EG MPSoC with 2 x 64 MByte Flash memory for configuration and operation, 8 GByte DDR4-SDRAM SO-DIMM socket with 64-bit wide data bus, 22 MGT lanes and powerful switch-mode power supplies for all on-board voltages. The TEB0911 board exposes the pins of the Zynq MPSoC to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq UltraScale+ MPSoC and for developing purposes. The board is capable to be fitted to a enclosure, whereby on the enclosure's rear and front panel, I/O's, LVDS-pairs and MGT lanes are accessible through 6 on-board FMC connectors and other standard high-speed interfaces, namely USB3, SFP+, SSD, GbE, etc.

Key Features

  • Zynq UltraScale+ MPSoC XCZU9EG-1FFVB1156E
    • 1156 Pin Package
  • 8 GByte 64-Bit DDR4 SO-DIMM (PS connected)
  • Active heat sink (serial number 638088 and above)
  • M2 PCIe SSD (1-Lane)
  • 8 GByte e.MMC (bootable)
  • 2 x 64 MByte Dual QSPI Flash (bootable)
  • System Controller(LCMXO2-7000HC)
    • Power Sequencing
    • IO Expander
  • Configurable PLLs
  • GTH/GTP Reference CLKs

Front Panel

  • 4 x FMC
    • 4 GTH per FMC
    • 68 ZynqMP PL IO per FMC
  • DisplayPort (2-Lanes)
  • RJ34 ETH + Dual USB3 Combo
  • Dual Stack SFP+
  • SD (bootable)
  • Status LEDs

Back Panel

  • 2 x FMC
    • 4/2 GTH
    • 12 ZynqMP PL IO per FMC
  • 56 SC IO per FMC
  • USB JTAG/UART ZynqMP
  • USB JTAG/GPIO FMC
  • CAN FD (DB9 Connector)
  • SMA (external CLK)
  • 5-pin 24 V power connector

Board size

  • 406 mm × 234.30 mm, please download the assembly diagram for exact details

Scope of Delivery

  • 1 x TEB0911-04-9BEX1MA Trenz Electronic UltraRack+ MPSoC board with Xilinx Zynq UltraScale+ ZU9EG
  • 1 x active heat sink, pre-assembled
20171115 04

產品編號：TEB0911-04-9BEX1MA
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TEF1002｜PCIe FMC Carrier

TEF1002 - Carrier board for Trenz Electronic modules with 4 x 5 cm form factor

The Trenz Electronic TEF1002-02 carrier is a baseboard for Trenz Electronic 4 x 5 cm SoMs. It is a PCIe x1 card providing a FMC LPC connector.

2022 10 31 135658

Key Features

  • Carrier for 4 x 5 modules
  • 3 x Trenz Electronic 4 x 5 modules B2B connectors
  • ANSI/VITA 57.1 compliant FMC LPC connector
  • SFP+ connector
  • PCIe x1
  • SATA connector with pin 7 power configuration for SATADoM
  • RJ45 Gigabit Ethernet connector
  • Micro-USB to JTAG/UART bridge
  • 2 x 8 lane high speed connectors (firefly)
  • Micro-USB connector
  • Micro-SD card connector
  • Cooling fan 5VDC
  • 4 x LEDs (2 User, Power and Status)
  • Module reset button
  • 10 x configuration/user dip switch
  • MAX10 System Controller CPLD

Scope of Delivery

  • 1 x TEF1002-02 carrier board for Trenz Electronic 4 x 5 cm modules
20171115 04

產品編號：TEF1002-02
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TEB0912｜Xilinx Zynq UltraScale+

TEB0912 -MPSoC Multi-function Board with Xilinx Zynq UltraScale+ ZU11, PS and PL DDR

The Trenz Electronic TEB0912 is a reconfigurable multi-function processing board based on Xilinx Zynq UltraScale+ ZU11EG and is intended to be used in the portable system. Designed for industrial and defense applications, the TEB0912 has an extra rigid PCB and extended temperature grade.

Smart power management provides full control of power system and support battery power supply with PMBUS interface. Integrated DDR4 memory implement good resistance for shock and vibration stress.

2022 10 31 140130

 

Key Features

General

  • Platform - XCZU11EG-1FFVC1760I
  • Power Supply -  12V ± 5%
  • JTAG interface over one channel of FT2232
  • Configurable Boot mode
  • 8 separate configurable clock sources
  • Status LEDs - Power-Good, FPGA Done
  • DRAM DDR4, 2400, 4 GByte (PS connected)
  • DRAM DDR4, 2400, 4 GByte (PL connected)
  • 64 MByte Flash Memory 2 x QSPI NOR-Flash
  • 16 GTY transceivers
  • 32 GTH transceivers
  • 2 x 25 HPIO-pairs

Interfaces

  • 2 x 1 Gb Ethernet connectors
  • M.2 (E) slot for WiFi module
  • M.2 (M) slot for SSD module
  • MicroSD slot for SD2.0 (SDR104). SD3.0 functionality cannot be guaranteed
  • CAN
  • 2 x SMBUS connectors
  • 4 x FireFly GTY (copper/optical)
  • 4 x FireFly JESD204 ADC
  • 4 x FireFly JESD204 DAC
  • USB JTAG/UART
  • 4 x B2B connectors with 48 LVDS pairs

Board size

  • 180 mm × 120 mm

Scope of Delivery

  • 1 x TEB0912-03-ABI21-A Trenz Electronic MPSoC Multi-function Board with Xilinx Zynq UltraScale+ ZU11EG
20171115 04

產品編號：TEB0912-03-ABI21-A
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TEF1001｜ PCIe FMC Carrier ｜Xilinx Kintex-7 (160T/325T/410T)

TEF1001-PCIe FMC Carrier with Xilinx Kintex-7 160T, 4 Lane PCIe GEN2, DDR3 SODIMM ECC

The Trenz Electronic TEF1001-02-B2IX4-A is a PCIe FMC Carrier integrating a Xilinx Kintex-7 160T FPGA, 32 MByte SPI Flash, a 4 lane PCIe and a DDR3 SODIMM with ECC Socket.

It can also be equipped with Kintex-7 325T or 410T

2022 10 31 135334

Key Features

  • Xilinx Kintex-7 XC7K160T-2FFG676I
  • 1 x Vita 57.1 FMC HPC Slot
  • 4 lane PCIe Gen2

  • DDR3 SODIMM with ECC Socket (max. 8 GByte)

  • 32 MByte SPI Flash

  • Programmable clock generator Si5338

  • 200 MHz Low-Jitter LVDS oscillator

  • 12V power input protection circuit

  • 12V power input through PCIe connector edge available (with priority to the ATX input power connector)

  • FMC FAN on/off controlled by a pin-present on FMC

  • High performance DC-DC converters

Scope of Delivery

  • 1 x TEF1001-02-B2IX4-A Trenz Electronic PCIe FMC Carrier with Xilinx Kintex-7 160T FPGA
20171115 04

產品編號：

TEF1001-02-B2IX4-A：Xilinx Kintex-7 160T

TEF1001-02-D2CX4-A：Xilinx Kintex-7 325T

TEF1001-02-G2IX4-A：Xilinx Kintex-7 410T
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  1. TEC0330｜ Xilinx Virtex-7 FPGA, 8 Lane PCIe GEN2, SODIMM SDRAM
  2. TEC0850｜ Xilinx Zynq UltraScale+ ZU15, 3U form factor
  3. TE0802｜ Xilinx Zynq UltraScale+
  4. TE0783｜ Xilinx Zynq Z-7045

和澄科技 Haley Technology

電話 │ 886-3-5790380
傳真 │ 886-3-5790370
信箱 │ sales@haleytech.com
地址 │ 新竹市關新路27號18樓之2

              

 

 

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