Products with Xilinx FPGA

TEI0022-DataStorm DAQ｜M-Board FMC Carrier for M-Series Precision Converters

The Trenz Electronic TEI0022 is a SoC board based on Intel Cyclone V FPGA, an Ethernet PHY, one GByte DDR3 SDRAM per HPS and FPGA and one 32 MByte Quad SPI Flash memory for configuration and operation per HPS and FPGA, and powerful switching-mode power supplies for all on-board voltages.

Key Features

• SoC FPGA
  • Intel Cyclone V (5CSEMA5F31C8N)
  • Package: FBGA 896 pins
  • Speed grade: 8
  • FPGA Temperature range: commercial (Tj = 0 °C to 85 °C)
• RAM/Storage
  • 1 GByte DDR3 SDRAM for HPS
  • 1 GByte DDR3 SDRAM for FPGA
  • 32 MByte SPI for HPS
  • 32 MByte SPI for FPGA
• On Board
  • Up to 7 x SMA connector
  • Temperature sensor
  • Intel MAX10 for board management
• Interface
  • LPC FMC connector
  • 4 x Pmod connector
  • JTAG
  • UART via micro USB B connector (for FPGA)
  • UART via micro USB B connector (for HPS)
  • 4 x USB 2.0 host
  • Ethernet via RJ45 connector
  • SD card
  • HDMI
• Power
  • 12V input supply voltage
• Dimension: 13 x 16 cm

Scope of Delivery

• 1 x TEI0022-03 Trenz Electronic SoC module with Intel Cyclone V FPGA
• 1 x 28169 power Supply with four exchangeable adapters and cable, 12V/2.5A
• 2 x bolts
• 4 x screws

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TE0812 (Xilinx UltraScale+) - Evaluationboard｜with Xilinx Zynq UltraScale+ ZU6EG-1I, 4 GB DDR4 ECC, 9 x 9 cm

The Trenz Electronic TE0812-02-EM2 is a powerful evaluationboard integrating a Xilinx Zynq UltraScale+ MPSoC with 4 GByte DDR4 SDRAM ECC, dual 64 MByte serial Flash memory for configuration and operation, dual 4 Mbit MRAM, 2 x 32 GByte e.MMC and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Key Features

• SoC/FPGA
  • Package: FFVC900
  • Device: ZU6
  • Engine: EG
  • Speedgrade: -1
  • Temperature range: Industrial
• RAM/Storage
  • 4 GByte DDR4 SDRAM with ECC
  • 2 x 32 GByte e.MMC
  • 2 x 64 MByte serial Flash
  • 2 x 4 Mbit MRAM
• On Board
  • Vorago VA41630-PQ176F0EBA
  • 2 x B2B APM6-100-06.5-L-04-2
  • LSHM-130-01-F-DH-A-S-K-TR Debug connector
• Interface to FPGA
  • via B2B Connector
    • 12 x GTH
    • 4 x GTR
    • 104 x HP PL I/Os (+1.8V)
    • 17 x HP PL AD I/Os (+1.8V)
    • 6 x HD PL I/Os (+3.3V)
    • MIOs for 2 x CAN
    • MIOs for ETH
  • via debug Connector
    • 2 x HD PL I/Os (+3.3V)
    • MIOs for ETH
    • MIOs for UART
• Interface to Vorago
  • via B2B Connector
    • SpaceWire
    • Ethernet
    • 4 x GPIO
    • 2 x Analog-Output
    • PPSIn/PPSOut
    • UART
    • 2 x CAN
    • I2C
  • via debug Connector
    • Reset
    • UART
    • JTAG
• Power
  • 12V power supply needed via B2B connector
• Dimension
  • 90 mm x 90 mm

Scope of Delivery

• 1 x TE0812-02-EM2 Trenz Electronic evaluationboard with Xilinx Zynq UltraScale+ ZU6EG

TEB0707 Carrier Board｜Trenz Electronic 4 x 5 Module Carrier for CRUVI Extension Boards

The Trenz Electronic TEB0707 is a carrier board for 4 x 5 Trenz Electronic modules. It provides three high speed and one low speed CRUVI extension connectors.

The TEB0707 is integrated with an Intel MAX 10 FPGA as system controller and is equipped with a Micro USB2.0 socket with FTDI to JTAG/UART solution, RJ45 LAN socket, USB A socket, microSD card socket, user LEDs, push buttons and DIP switches for controlling the SoM.

Key Features

Modules

• 4 x 5 Trenz Electronic modules

RAM/Storage

• EEPROM (FTDI configuration)

On Board

• Intel MAX 10 FPGA
• FTDI FT2232
• 6 x user LEDs (3 x green, 3 x red)
• 2 x status LEDs
• DIP switch
• Push buttons

Interface

• Gigabit RJ45 LAN socket
• MicroSD card socket
• Micro USB2.0 socket
• USB A socket
• 3 x High Speed CRUVI B2B connectors
• 1 x Low Speed CRUVI B2B connector
• 4 x Jumpers

Power: 5V input power supply

Dimension: 135 x 68 mm

Scope of Delivery

• 1 x TEB0707-02 carrier board for Trenz Electronic 4 x 5 cm modules

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