TE0783－High-Performance SoM with Xilinx Zynq Z-7045, Memory on both PS+PL, 8.5 x 8.5

The Trenz Electronic TE0783 is a high-performance, industrial-grade SoM (System on Module) based on Xilinx Zynq-7000 SoC (XC7Z045) with 1 GByte (32-bit) DDR3 RAM connected to PS, 2 GByte (64-bit) DDR3 RAM connected to PL, 4 GByte e.MMC, 16 GTX high-performance transceiver lanes, 32 MByte QSPI Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. 

Features

• Xilinx Zynq-7000 XC7Z045-2FFG900I SoC
• Rugged for shock and high vibration
• Large number of configurable I/Os are provided via rugged high-speed stacking strips
• Dual ARM Cortex-A9 MPCore
  • 1 GByte (32-bit) DDR3 RAM connected to PS
  • 2 GByte (64-bit) DDR3 RAM connected to PL
  • 32 MByte QSPI Flash memory
  • Hi-Speed USB 2.0 ULPI transceiver PHY
  • Gigabit (10/100/1000 Mbps) Ethernet transceiver PHY
  • 4 GByte e.MMC (optional up to 64 GByte)
• Lattice MachXO2 HC 4000 System Controller CPLD
  • 40 GPIO's available to user on B2B connector
• MAC-address EEPROM
• Serial user EEPROM
• Temperature compensated RTC (real-time clock)
• Si5338A programmable quad PLL clock generator for GTX transceiver clocks
• Plug-on module with 3 x 160-pin high-speed strips
  • 16 GTX high-performance transceiver
  • 4 x GT transceiver clock inputs
  • 166 FPGA I/O's (83 LVDS pairs)
• On-board high-efficiency switch-mode DC-DC converters
• System management
• eFUSE bit-stream encryption
• AES bit-stream encryption
• Evenly-spread supply pins for good signal integrity
• User LED

Scope of Delivery

• 1 x TE0783-02-92I33MA Trenz Electronic SoM with Xilinx Zynq-7045 FPGA

TEC0850－CompactPCI Serial Card with Xilinx Zynq UltraScale+ ZU15, 3U form factor

The Trenz Electronic TEC0850 board is a CompactPCI Serial card (3U form factor) integrating a Xilinx Zynq UltraScale+ MPSoC ZU15EG, one DDR4 SDRAM SODIMM socket with 64bit wide data bus, 128 MByte Flash memory for configuration and operation, 24 Gigabit transceivers on PL side and 4 on PS side, powerful switch-mode power supplies for all onboard voltages, USB2 and USB3 FIFO bridges and a large number of configurable I/Os available on the CompactPCI Serial backplane connectors.

Key Features

• Xilinx Zynq UltraScale+ XCZU15EG-1FFVB1156E
• ZU15EG, 1156 Pin Packages
• Dimensions: 3U, 8HP CompactPCI-Serial
• Rugged for shock and high vibration.
• Front side interface connectors
  • RJ-45 GbE Ethernet interface
  • Circular push/pull connector with 4x on-board 8bit DAC output
  • MicroSD Card connector
  • USB 2.0 and USB 3.0 to FIFO bridge connector
  • 4x status LEDs
• 4 CompactPCI Serial connectors for backplane connection (3U form factor)
  • 24 GTH lanes
  • 4 PS GTR lanes
  • USB 2.0 interface
  • 64 Zynq PL HP I/O's
  • 8x PLL clock input
  • JTAG, I²C and 7 user I/O's to MAX10 FPGA
• 8 GByte (up to 32 GByte possible configuration) DDR4 SODIMM, 64-bit width, support DDR4 SODIMM with ECC
• 128 MByte dual parallel QSPI Flash (bootable), 512 MByte maximum
• 26-pin header with 20 Zynq PL HD I/O's
• 3-pin header with 2 MAX10 FPGA I/O's
• System Controller (Altera MAX10 FPGA SoC)
  • Power Sequencing
  • System management and control for MPSoC and onboard peripherals
• Si5345 programmable 10 output PLL clock generator
• Si53340 Quad clock buffer
• 1x user push button
• Zynq MPSoC cooling FAN connector
• On-board high-efficiency DC-DC converters
• Evenly spread supply pins for good signal integrity.

Scope of Delivery

• 1 x TEC0850-03-BBEX1-A Trenz Electronic CompactPCI Serial Card with Xilinx Zynq UltraScale+ ZU15EG

TE0802－MPSoC Development Board with Xilinx Zynq UltraScale+

The Trenz Electronic TE0802 is a development board integrating a Xilinx Zynq UltraScale+. Other assembly options for the FPGA and the memory chips are available.

．Xilinx Zynq UltraScale+ ZU2,1 GB

．Xilinx Zynq UltraScale+ ZU1,1 GB

Key Features

• Xilinx Zynq UltraScale+ XCZU2CG-1SBVA484E
• Storage
  • 1 GByte LPDDR4
  • 32 MByte SPI Flash
  • MicroSD card
  • M2 PCIe SSD support
• Display
  • DisplayPort
  • VGA
  • 4-digit 7-segment LED
  • 8 LEDs
• Audio: 3.5 mm jack
• 2 x Pmod connectors
• Communication and Debug
  • USB 3.0 Host (type A connector)
  • USB JTAG/UART Micro-USB
  • Gigabit Ethernet RJ45
• Input
  • 5 push buttons
  • 8 bit slide switches
  • Reset button
• EEPROM
• Power supply: 5V plug
• Size: 100 mm × 100 mm. Please download the assembly diagram for exact numbers.

Scope of Delivery

• 1 x TE0802-02-2AEV2-A MPSoC development board with Xilinx Zynq UltraScale+

TEC0330－PCIe FMC Carrier with Xilinx Virtex-7 FPGA, 8 Lane PCIe GEN2, SODIMM SDRAM

The Trenz Electronic TEC0330 is a PCI Express form factor card (PCIe 2.0 or higher) integrating the Xilinx Virtex-7 XC7VX330T FPGA chip. This high-end FPGA card is designed for maximum system performance and intended for use in applications with high demands on system throughput. There is a SO-DIMM socket on the board for standard DDR3 SDRAM extension memory module.

The TEC0330 features HPC (High Pin Count) ANSI/VITA 57.1 compatible FMC interface connector for standard I/O Mezzanine modules. Other interface connectors found on-board include JTAG for accessing FPGA and on-board System Controller CPLD, and also connector with 5 high-speed I/O differential signaling pairs.

Key Features

• Xilinx Virtex-7 FPGA module XC7VX330T-2FFG1157C (commercial temperature range)
• PCI Express 2.0 x8 card with maximum throughput of 4 GB/s
• FMC High Pin Count (HPC) connector
• 8 FPGA MGT lanes available on PCIe interface
• DDR3 SODIMM SDRAM socket
• 256-Mbit (32-MByte) Quad SPI Flash memory (for configuration and operation) accessible through:
  • FPGA
  • JTAG port (SPI indirect, bus width x4)
• External clock input via SMA coaxial connector
• 28 GTH transceivers, each with up to 13.1 Gbit/s data transmission rate
• FPGA configuration through:
  • JTAG connector
  • SPI Flash memory
• Programmable quad clock generator
• TI LMK04828B ultra low-noise JESD204B compliant clock jitter cleaner
• On-board high-efficiency DC-DC converters
• Up to 202 FPGA I/O pins available on FMC connector (up to 101 LVDS pairs possible)
• System management and power sequencing
• AES bit-stream encryption
• eFUSE bit-stream encryption

Scope of Delivery

• 1 x TEC0330-05 Trenz Electronic PCIe FMC Carrier with Xilinx Virtex-7 330T FPGA