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TE0716 | Xilinx Zynq-7000-SoC XC7Z020

TE0716 - SoM with Xilinx Zynq-7000 SoC XC7Z020, 1 GByte DDR3L, 45 x 65 mm

The Trenz Electronic TE0716 is a commercial-grade* SoM (System on Module) based on Xilinx Zynq-7000 SoC XC7Z020*, with 1 GByte of DDR3L-1600 SDRAM*, 32 MByte of SPI Flash memory, 10 x 12-Bit Low Power SAR ADCs, 512 Kb serial EEPROM, Gigabit Ethernet PHY transceiver, an USB PHY transceiver, a single chip USB2.0 to UART/JTAG interface (Xilinx license included), and powerful switching-mode power supplies for all on-board voltages. A large number of configurable I/Os are provided via rugged high-speed board-to-board connectors.

 

 

Key Features

  • SoC/FPGA
    • Package: CLG484
    • Device: Xilinx Z-7020
    • Speed: -1 *
    • Temperature: C grade *.
  • RAM/Storage
    • Low Power DDR3 SDRAM on PS
      • Data width: 32bit
      • Size: def. 1GB *
      • Speed: 1600 Mbps **
    • QSPI boot Flash
      • Data width: 4bit
      • Size: 32MB *
    • MAC address serial EEPROM with EUI-48™ node identity
    • 512Kb user MAC address serial EEPROM.
  • On Board
    • 10x 12-Bit Low Power SAR ADCs up to 2 MSPS
    • Low Power Oscillators.
    • Gigabit Ethernet PHY transceiver
    • High-Speed USB 2.0 ULPI transceiver with full OTG support
    • Single chip High-Speed USB 2.0 to UART/JTAG Interface (Xilinx License included) (FTDI FT2232H).
    • 2 x User RGB LEDs (Green), LED FPGA "Done" (Green).
    • 2 x Tactile Switches (User), 1 x Tactile Switche (Reset).
  • Interface
    • 120 x HR PL I/Os (3 banks).
    • 2 x PS MIOs (shared with UART TX/RX ZYNQ-FTDI).
    • 1 Gbps RGMII Ethernet interface.
    • High Speed USB 2.0 ULPI with full OTG support.
    • High Speed USB 2.0 to UART/JTAG interface, including microUSB-B connector.
    • microSD
    • JTAG
  • Power
    • On-board high-efficiency DC-DC converters for all voltages used.
  • Dimension
    • 45 x 65 mm
  • Notes
    • * depends on assembly version
    • ** depends on used Zynq and DDR3 combination

Scope of Delivery

  • 1 x TE0716-01-61C32-A SoM with Xilinx Zynq-7000 SoC XC7Z020

  產品編號: TE0716-01-61C32-A

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TE0865| Xilinx UltraScale+ Series

TE0865 Xilinx UltraScale+ Series- ZU11-Xilinx Zynq UltraScale+, SDRAM on PS and PL, Flash, Ethernet, USB(ZU11, ZU17, ZU19)

The Trenz Electronic TE0865 Series is a high-performance MPSoC module integrating a Xilinx Zynq UltraScale+ ZU11 / ZU17 / ZU19, 4 GByte DDR4 SDRAM with ECC on PS, 4 GByte DDR4 SDRAM on PL, 256 MByte Flash memory for configuration and operation, Gigabit Ethernet PHY, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

 

 

Key Features

  • Xilinx Zynq UltraScale+ Series
  • ZU11EG, C1760 Pin Packages
  • Rugged for shock and high vibration
  • Graphics Processing Unit (GPU): Mali-400 MP2
  • Plug-on module with 4 x Samtec ADM6 board to board connectors
  • 4 GByte (64-bit) DDR4 SDRAM with ECC on PS
  • 4 GByte (64-bit) DDR4 SDRAM on PL
  • 256 MByte QSPI boot Flash
  • 8 GByte e.MMC
  • 1 x Gigabit Ethernet transceiver PHY
  • USB2.0 PHY
  • Total I/O: 370
  • Gigabit transceivers: 32 x GTH, 16 x GTY, 4 x GTR
  • EEPROM with MAC
  • System controller (Intel MAX 10)
  • All power supplies on board, 12V single supply
  • Evenly spread supply pins for good signal integrity
  • Dimensions: 7.5 x 10 cm form factor

Scope of Delivery

  • 1 x TE0865-02-ABI21MA Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU11EG

  產品編號:

TE0865-02-ABI21MA:Zynq UltraScale+ ZU11EG-1I, 4 GB DDR4 (PS), 4 GB DDR4 (PL)

TE0865-02-DGE23MA:Zynq UltraScale+ ZU17EG-2E, 4 GB DDR4 (PS), 4 GB DDR4 (PL)

TE0865-02-FBE23MA:Zynq UltraScale+ ZU19EG-1E, 4 GB DDR4 (PS), 4 GB DDR4 (PL)

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TE0812 Evaluationboard |Xilinx UltraScale+

TE0812 (Xilinx UltraScale+) - Evaluationboard|with Xilinx Zynq UltraScale+ ZU6EG-1I, 4 GB DDR4 ECC, 9 x 9 cm

The Trenz Electronic TE0812-02-EM2 is a powerful evaluationboard integrating a Xilinx Zynq UltraScale+ MPSoC with 4 GByte DDR4 SDRAM ECC, dual 64 MByte serial Flash memory for configuration and operation, dual 4 Mbit MRAM, 2 x 32 GByte e.MMC and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Key Features

  • SoC/FPGA
    • Package: FFVC900
    • Device: ZU6
    • Engine: EG
    • Speedgrade: -1
    • Temperature range: Industrial
  • RAM/Storage
    • 4 GByte DDR4 SDRAM with ECC
    • 2 x 32 GByte e.MMC
    • 2 x 64 MByte serial Flash
    • 2 x 4 Mbit MRAM
  • On Board
    • Vorago VA41630-PQ176F0EBA
    • 2 x B2B APM6-100-06.5-L-04-2
    • LSHM-130-01-F-DH-A-S-K-TR Debug connector
  • Interface to FPGA
    • via B2B Connector
      • 12 x GTH
      • 4 x GTR
      • 104 x HP PL I/Os (+1.8V)
      • 17 x HP PL AD I/Os (+1.8V)
      • 6 x HD PL I/Os (+3.3V)
      • MIOs for 2 x CAN
      • MIOs for ETH
    • via debug Connector
      • 2 x HD PL I/Os (+3.3V)
      • MIOs for ETH
      • MIOs for UART
  • Interface to Vorago
    • via B2B Connector
      • SpaceWire
      • Ethernet
      • 4 x GPIO
      • 2 x Analog-Output
      • PPSIn/PPSOut
      • UART
      • 2 x CAN
      • I2C
    • via debug Connector
      • Reset
      • UART
      • JTAG
  • Power
    • 12V power supply needed via B2B connector
  • Dimension
    • 90 mm x 90 mm

Scope of Delivery

  • 1 x TE0812-02-EM2 Trenz Electronic evaluationboard with Xilinx Zynq UltraScale+ ZU6EG

  

  產品編號:TE0812-02-EM2

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TE0812 Space-grade MPSoC Module |Xilinx Zynq UltraScale+

TE0812 Space-grade MPSoC Module|with Xilinx Zynq UltraScale+ ZU6EG-1I, 4 GByte DDR4 ECC

The Trenz Electronic TE0812-02-EIVEFM2 is a powerful space grade module integrating a Xilinx Zynq UltraScale+ MPSoC with 4 GByte DDR4 SDRAM ECC, dual 128 MByte serial Flash memory for configuration and operation, dual 4 Mbit MRAM, 2 x 32 GByte e.MMC, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Key Features

  • SoC/FPGA
    • Package: FFVC900
    • Device: ZU6
    • Engine: EG
    • Speedgrade: -1
    • Temperature range: Industrial
  • RAM/Storage
    • 4 GByte DDR4 SDRAM with ECC
    • 2 x 32 GByte e.MMC
    • 2 x 128 MByte serial Flash
    • 2 x 4 Mbit MRAM
  • On Board
    • Vorago VA41630-PQ176F0EBA
    • 2 x B2B APM6-100-06.5-L-04-2
    • LSHM-130-01-F-DH-A-S-K-TR Debug Interface
  • Interface to FPGA
    • via B2B Connector
      • 12 x GTH
      • 4 x GTR
      • 104 x HP PL I/Os (+1.8V)
      • 17 x HP PL AD I/Os (+1.8V)
      • 6 x HD PL I/Os (+3.3V)
      • MIOs for 2 x CAN
      • MIOs for ETH
    • via debug Connector
      • 2 x HD PL I/Os (+3.3V)
      • MIOs for ETH
      • MIOs for UART
  • Interface to Vorago
    • via B2B Connector 
      • SpaceWire
      • Ethernet
      • 4 x GPIO
      • 2 x Analog-Output
      • PPSIn/PPSOut
      • UART
      • 2 x CAN
      • I2C
    • via debug Connector
      • Reset
      • UART
      • JTAG
  • Power
    • 12 V power supply needed via B2B connector
  • Dimension
    • 90 mm x 90 mm

Scope of Delivery

  • 1 x TE0812-02-EIVEFM2 Trenz Electronic space-grade MPSoC module with Xilinx Zynq UltraScale+ ZU6EG

 

  產品編號:TE0812-02-EIVEFM2

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TEB0707|Carrier Board

TEB0707 Carrier Board|Trenz Electronic 4 x 5 Module Carrier for CRUVI Extension Boards

The Trenz Electronic TEB0707 is a carrier board for 4 x 5 Trenz Electronic modules. It provides three high speed and one low speed CRUVI extension connectors.

The TEB0707 is integrated with an Intel MAX 10 FPGA as system controller and is equipped with a Micro USB2.0 socket with FTDI to JTAG/UART solution, RJ45 LAN socket, USB A socket, microSD card socket, user LEDs, push buttons and DIP switches for controlling the SoM.

 

Key Features

Modules

  • 4 x 5 Trenz Electronic modules

RAM/Storage

  • EEPROM (FTDI configuration)

On Board

  • Intel MAX 10 FPGA
  • FTDI FT2232
  • 6 x user LEDs (3 x green, 3 x red)
  • 2 x status LEDs
  • DIP switch
  • Push buttons

Interface

  • Gigabit RJ45 LAN socket
  • MicroSD card socket
  • Micro USB2.0 socket
  • USB A socket
  • 3 x High Speed CRUVI B2B connectors
  • 1 x Low Speed CRUVI B2B connector
  • 4 x Jumpers

Power: 5V input power supply

Dimension: 135 x 68 mm

 

Scope of Delivery

  • 1 x TEB0707-02 carrier board for Trenz Electronic 4 x 5 cm modules

 

規格:

Modules

Connectors

RAM/

Storage

On Board

Interface

Power

4 x 5 Trenz Electronic Modules

3 x High Speed CRUVI 1 x Low Speed CRUVI

EEPROM (FTDI

conguration)

Intel Max 10 FPGA, FTDI FT2223, 6 x user LEDs (3 x green, 3 x red), 2 x status LEDs, DIP switch, push buttons

Gigabit RJ45 LAN socket, MicroSD card socket, Micro USB2.0 socket, USB A socket, 4 x jumpers

5V input power supply

 

  產品編號:TEB0707-02

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