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TE0830|Xilinx UltraScale+ ZU11EG-1I

TE0830| MPSoC Module with Xilinx Zynq UltraScale+ ZU11EG-1I, COM HPC Standard(12 x 12cm)

The Trenz Electronic TE0830 is a COM-HPC compatible Zynq UltraScale+ module (12 x 12 cm). COM-HPC is the new PICMG-standard.

The TE0830 features high memory connectivity (PS up to 8 GByte and PL DDR up to 16 GByte) as well as fast Gigabit transceivers (up to 32.75 Gb/s) allowing PCIe Gen4 to be implemented as root complex or endpoint. Storage memory can be expanded as desired (SATA or M.2 PCIe storage card on carrier). In addition to these interfaces, USB, Gigabit Ethernet and several other common interfaces are available. The JTAG connection for programming the ZynqMP can be done via GPIO pins or conveniently via Ethernet (with current firmware), so that the use in the server area is also possible. TE0830 is currently under development, but an initial prototype has been fielded and functionality is currently being verified on the TEBT0830 test carrier. Expected release in Q3/Q4 2021 (with reservations).

 

 

Key Features (preliminary)

  • SoC/FPGA (Zynq UltraScale+)
    • Package: FFVC1760
    • Device: ZU11 (assembly option ZU17, ZU19 possible*)
    • Engine: EG
    • Speed: -1 (assembly option, -2,-3*, ** possible)
    • Temperature: I (assembly option E, (Q, M) possible*,**)
  • RAM/Storage
    • DDR4 (PS connected)
      • Data width: 72-bit with ECC
      • Size: 4 GByte (assembly option up to 8 GByte possible*)
      • Speed:***
    • DDR4 SODIMM (PL connected)
      • 72-bit DDR4 with ECC
      • Size: max 16 GByte*
      • Speed: NA*
    • e.MMC
      • Data width: 8-bit
      • Size: 64 GByte (max)
    • QSPI boot Flash in dual parallel mode
      • Data width: 8-bit
      • Size: 128 MByte (assembly up to 512 MByte possible*)
    • QDDRII
      • Size: 18 Mbit (assembly option possible*, default not assembled)
    • MAC address serial EEPROM with EUI-48™ node identity
  • On Board
    • SC CPLD ans SoC
      • Intel MAX 10: 10M08
      • Xilinx Zynq-7000: XC7Z010 with 128 MByte QSPI and 512 MByte DDR3 (16-bit)
    • PLL SI5345
    • Gigabit ETH PHY
    • USB2 HUB
    • USB2 PHY
  • Interface (2 x 400pin COM-HPC connectors)
    • 1 x PCIe SMB (ZynqMP PS GTR)
    • PCIe up to 48 lane (16 x GTY (32.75 Gb/s) and 32 x GTH (16.3 Gb/s))**
    • 1 x Gbit Ethernet
    • 4 x USB2
    • 1 x USB3 (ZynqMP PS GTR)
    • 1 x DDI (DP) (ZynqMP PS GTR)
    • 1 x SATA (ZynqMP PS GTR)
    • 1 x SPI
    • 1 x I2C SMB
    • 3 x I2C
    • 2 x UART (1x ZynqMP, 1x SC Zynq)
    • 12 x GPIO (JTAG over GPIO)
    • PL HP IOs  x32 (15 diff) over COM-HPC CSI interface
  • Power
    • 12V main
    • 5V standby
    • 2.0-3.3V RTC
  • Dimension
    • COM-HPC client module size B (120 x 120 mm)

Notes
* depends on assembly version
** not all combinations are possible
*** depends on used Zynq UltraScale+ and DDR4 combination
**** uses is limited by Zynq UltraScale+ specification

  產品編號:TE0830-01-ABI26FAP

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AM0010|Xilinx Zynq UltraScale+ ZU4EV-1E

MPSoC-Modul mit Xilinx Zynq UltraScale+ ZU4EV-1E,4 GByte DDR4,4 x 5,64 cm

The Trenz Electronic AM0010-02-4DE21MA is a MPSoC module integrating a Xilinx Zynq UltraScale+ ZU4EV, 4 GByte DDR4 SDRAM with ECC, 2 x 64 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint of 4 x 5.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

All parts are at least extended temperature range of 0°C to +85°C. The module operating temperature range depends on customer design and cooling solution. Please contact us for options.

 

 Key Features

  • Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E
    • ZU4EV, 784 Pin-Package
    • Application Processor: Quad-core Arm Cortex-A53 MPCore up to 1.5 GHz
    • Real-Time Processor: Dual-core Arm Cortex-R5 MPCore up to 600 MHz
  • 4 GByte DDR4 SDRAM with ECC (PS)
  • 2 x 64 MByte QSPI Flash
  • 8 GByte e.MMC
  • Serial EEPROM with EUI-48 Node Identity
  • Plug-on module with 2 x 240-pin B2B connectors
  • User I/Os
    • 204 SE
    • 102 DIFF GPIOs
    • Serial transceivers: 4 x PS-GTR, 4 x PL-GTH
  • Gigabit Ethernet transceiver
  • USB2.0 transceiver
  • OPTIGA Trust M (Security controller)
  • CryptoAuthentication Device
  • Oscillator
  • Analog Multiplexer
  • Rugged for shock and high vibration
  • Size: 4 x 5.64 cm
  • Evenly-spread supply pins for good signal integrity

Scope of Delivery

  • 1 x AM0010-02-4DE21MA Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU4EV
  • 8 x screws
  • 4 x bolts

  產品編號:

AM0010-02-4DE21MA:ZU4EV-1E

AM0010-02-2AE21MA:ZU2CG-1E

AM0010-02-4AE21MA:ZU4CG-1E

AM0010-02-3BE21MA:ZU3EG-1E

AM0010-02-3BI21MA:ZU3EG-1I

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TE0722|Xilinx Z-7007S

TE0722-Z-7007S|DIPFORTy1 "Soft Propeller" with Xilinx Z-7007S Single-core, 16 MByte Flash

The DIPFORTy1 "Soft Propeller" is based on the Xilinx Zynq-7000S, a System on Chip which contains a FPGA and a Single-core ARM A9+ processor with enough logic gates to become a Propeller. The board also has 16 MByte of Flash used for configuration and everything fits on a Propeller-compatible DIP 40 pinout.

DIPFORTy1 "Soft-Propeller" is the lowest cost Zynq-based module ever made and the first ZYNQ module that can use existing bases and project boards (Parallax Propeller chip compatibility). All this in a compact 1.8 x 5.1 cm form factor, at the most competitive price.

This device contains a single-core ARM Cortex-A9 processor and represents the lowest cost entry point to the scalable Zynq-7000 platform.

 

Key Features

  • Xilinx Zynq-7: XC7Z007S-1CLG225C
    • 16 MByte SPI Flash (primary boot)
    • 33.333 MHz Clock (MEMS Oscillator)
    • Single-core ARM A9+
  • DIP40 form factor
    • 2 x 20 holes for socket pins or pin-header
    • Size: 18 x 51 mm
  • Total user accessible PL I/O: 46 (+3 Input only)
    • DIP40 header pins: 34 I/O
    • XMOD J1: 6 I/O
    • XMOD J2: JTAG + 2 I/O (or 3 input + 2 I/O)
    • XMOD J3: 4 I/O
  • 3.3 V single supply
  • RGB LED (PL I/O connected)
  • "Done" LED (inverted polarity)
  • User LED (ARM CPU MIO GPIO)
  • MicroSD Card socket (MIO, ZYNQ secondary boot media)
  • Sil1143 Proximity and ambient light sensor

Scope of Delivery

  • 1 x TE0722-02-07S-1C Trenz Electronic module with Xiinx Zynq-XC7Z007S
  • 1 x Pinheader, double row, 10-pins, straight
  • 2 x Pinheader, single row, 20-pins, straight

  產品編號:TE0722-02-07S-1C

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TE0812 Space-grade MPSoC Module |Xilinx Zynq UltraScale+

TE0812 Space-grade MPSoC Module|with Xilinx Zynq UltraScale+ ZU6EG-1I, 4 GByte DDR4 ECC

The Trenz Electronic TE0812-02-EIVEFM2 is a powerful space grade module integrating a Xilinx Zynq UltraScale+ MPSoC with 4 GByte DDR4 SDRAM ECC, dual 128 MByte serial Flash memory for configuration and operation, dual 4 Mbit MRAM, 2 x 32 GByte e.MMC, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

Key Features

  • SoC/FPGA
    • Package: FFVC900
    • Device: ZU6
    • Engine: EG
    • Speedgrade: -1
    • Temperature range: Industrial
  • RAM/Storage
    • 4 GByte DDR4 SDRAM with ECC
    • 2 x 32 GByte e.MMC
    • 2 x 128 MByte serial Flash
    • 2 x 4 Mbit MRAM
  • On Board
    • Vorago VA41630-PQ176F0EBA
    • 2 x B2B APM6-100-06.5-L-04-2
    • LSHM-130-01-F-DH-A-S-K-TR Debug Interface
  • Interface to FPGA
    • via B2B Connector
      • 12 x GTH
      • 4 x GTR
      • 104 x HP PL I/Os (+1.8V)
      • 17 x HP PL AD I/Os (+1.8V)
      • 6 x HD PL I/Os (+3.3V)
      • MIOs for 2 x CAN
      • MIOs for ETH
    • via debug Connector
      • 2 x HD PL I/Os (+3.3V)
      • MIOs for ETH
      • MIOs for UART
  • Interface to Vorago
    • via B2B Connector 
      • SpaceWire
      • Ethernet
      • 4 x GPIO
      • 2 x Analog-Output
      • PPSIn/PPSOut
      • UART
      • 2 x CAN
      • I2C
    • via debug Connector
      • Reset
      • UART
      • JTAG
  • Power
    • 12 V power supply needed via B2B connector
  • Dimension
    • 90 mm x 90 mm

Scope of Delivery

  • 1 x TE0812-02-EIVEFM2 Trenz Electronic space-grade MPSoC module with Xilinx Zynq UltraScale+ ZU6EG

 

  產品編號:TE0812-02-EIVEFM2

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TE0722| DIPFORTy Soft Propeller Xilinx Zynq-7010

TE0722|DIPFORTy1 Soft Propeller with Xilinx Zynq-7010 and 16 MByte Flash

The DIPFORTy1 "Soft Propeller" is based on the Xilinx Zynq-7010, a System on Chip which contains a FPGA and a Dual Core ARM A9+ processor with enough logic gates to become a Propeller. The board also has 16 MByte of Flash used for configuration and everything fits on a Propeller-compatible DIP 40 pinout.

DIPFORTy1 "Soft-Propeller" is the lowest cost Zynq-based module ever made and the first ZYNQ module that can use existing bases and project boards (Parallax Propeller chip compatibility). All this in a compact 1.8 x 5.1 cm form factor, at the most competitive price. 

 

Key Features

  • Xilinx Zynq-7 XC7Z010-1CLG225C
    • 16 MByte SPI Flash (primary boot)
    • 33.333 MHz Clock (MEMS Oscillator)
    • Dual Core ARM A9+
  • DIP40 form factor
    • 2 x 20 holes for socket pins or pin-header
    • Size: 18 x 51 mm
  • Total user accessible PL I/O: 46 (+3 Input only)
    • DIP40 header pins: 34 I/O
    • XMOD J1: 6 I/O
    • XMOD J2: JTAG + 2 I/O (or 3 input + 2 I/O)
    • XMOD J3: 4 I/O
  • 3.3 V single supply
  • RGB LED (PL I/O connected)
  • "Done" LED (inverted polarity)
  • User LED (ARM CPU MIO GPIO)
  • MicroSD Card socket (MIO, ZYNQ secondary boot media)
  • Sil1143 Proximity and ambient light sensor

Scope of Delivery

  • 1 x TE0722-02 Trenz Electronic module with Xilinx Zynq-7010
  • 1 x Pinheader, double row, 10-pins, straight
  • 2 x Pinheader, single row, 20-pins, straight

  產品編號:TE0722-02

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