Products with Xilinx FPGA

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Products with Xilinx FPGA

TEF1001｜ PCIe FMC Carrier ｜Xilinx Kintex-7 (160T/325T/410T)

TEF1001-PCIe FMC Carrier with Xilinx Kintex-7 160T, 4 Lane PCIe GEN2, DDR3 SODIMM ECC

The Trenz Electronic TEF1001-02-B2IX4-A is a PCIe FMC Carrier integrating a Xilinx Kintex-7 160T FPGA, 32 MByte SPI Flash, a 4 lane PCIe and a DDR3 SODIMM with ECC Socket.

It can also be equipped with Kintex-7 325T or 410T

Key Features

  • Xilinx Kintex-7 XC7K160T-2FFG676I
  • 1 x Vita 57.1 FMC HPC Slot
  • 4 lane PCIe Gen2

  • DDR3 SODIMM with ECC Socket (max. 8 GByte)

  • 32 MByte SPI Flash

  • Programmable clock generator Si5338

  • 200 MHz Low-Jitter LVDS oscillator

  • 12V power input protection circuit

  • 12V power input through PCIe connector edge available (with priority to the ATX input power connector)

  • FMC FAN on/off controlled by a pin-present on FMC

  • High performance DC-DC converters

Scope of Delivery

  • 1 x TEF1001-02-B2IX4-A Trenz Electronic PCIe FMC Carrier with Xilinx Kintex-7 160T FPGA

產品編號：

TEF1001-02-B2IX4-A：Xilinx Kintex-7 160T

TEF1001-02-D2CX4-A：Xilinx Kintex-7 325T

TEF1001-02-G2IX4-A：Xilinx Kintex-7 410T
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Products with Xilinx FPGA

TEF1002｜PCIe FMC Carrier

TEF1002 - Carrier board for Trenz Electronic modules with 4 x 5 cm form factor

The Trenz Electronic TEF1002-02 carrier is a baseboard for Trenz Electronic 4 x 5 cm SoMs. It is a PCIe x1 card providing a FMC LPC connector.

Key Features

  • Carrier for 4 x 5 modules
  • 3 x Trenz Electronic 4 x 5 modules B2B connectors
  • ANSI/VITA 57.1 compliant FMC LPC connector
  • SFP+ connector
  • PCIe x1
  • SATA connector with pin 7 power configuration for SATADoM
  • RJ45 Gigabit Ethernet connector
  • Micro-USB to JTAG/UART bridge
  • 2 x 8 lane high speed connectors (firefly)
  • Micro-USB connector
  • Micro-SD card connector
  • Cooling fan 5VDC
  • 4 x LEDs (2 User, Power and Status)
  • Module reset button
  • 10 x configuration/user dip switch
  • MAX10 System Controller CPLD

Scope of Delivery

  • 1 x TEF1002-02 carrier board for Trenz Electronic 4 x 5 cm modules

產品編號：TEF1002-02
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Products with Xilinx FPGA

TEB0911｜ UltraRack+ Board｜Xilinx Zynq UltraScale+

TEB0911－UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC Connectors

The Trenz Electronic TEB0911 UltraRack+ board is integrating a Xilinx Zynq UltraScale+ ZU9EG MPSoC with 2 x 64 MByte Flash memory for configuration and operation, 8 GByte DDR4-SDRAM SO-DIMM socket with 64-bit wide data bus, 22 MGT lanes and powerful switch-mode power supplies for all on-board voltages. The TEB0911 board exposes the pins of the Zynq MPSoC to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq UltraScale+ MPSoC and for developing purposes. The board is capable to be fitted to a enclosure, whereby on the enclosure's rear and front panel, I/O's, LVDS-pairs and MGT lanes are accessible through 6 on-board FMC connectors and other standard high-speed interfaces, namely USB3, SFP+, SSD, GbE, etc.

Key Features

  • Zynq UltraScale+ MPSoC XCZU9EG-1FFVB1156E
    • 1156 Pin Package
  • 8 GByte 64-Bit DDR4 SO-DIMM (PS connected)
  • Active heat sink (serial number 638088 and above)
  • M2 PCIe SSD (1-Lane)
  • 8 GByte e.MMC (bootable)
  • 2 x 64 MByte Dual QSPI Flash (bootable)
  • System Controller(LCMXO2-7000HC)
    • Power Sequencing
    • IO Expander
  • Configurable PLLs
  • GTH/GTP Reference CLKs

Front Panel

  • 4 x FMC
    • 4 GTH per FMC
    • 68 ZynqMP PL IO per FMC
  • DisplayPort (2-Lanes)
  • RJ34 ETH + Dual USB3 Combo
  • Dual Stack SFP+
  • SD (bootable)
  • Status LEDs

Back Panel

  • 2 x FMC
    • 4/2 GTH
    • 12 ZynqMP PL IO per FMC
  • 56 SC IO per FMC
  • USB JTAG/UART ZynqMP
  • USB JTAG/GPIO FMC
  • CAN FD (DB9 Connector)
  • SMA (external CLK)
  • 5-pin 24 V power connector

Board size

  • 406 mm × 234.30 mm, please download the assembly diagram for exact details

Scope of Delivery

  • 1 x TEB0911-04-9BEX1MA Trenz Electronic UltraRack+ MPSoC board with Xilinx Zynq UltraScale+ ZU9EG
  • 1 x active heat sink, pre-assembled

產品編號：TEB0911-04-9BEX1MA
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TEB0912｜Xilinx Zynq UltraScale+

TEB0912 -MPSoC Multi-function Board with Xilinx Zynq UltraScale+ ZU11, PS and PL DDR

The Trenz Electronic TEB0912 is a reconfigurable multi-function processing board based on Xilinx Zynq UltraScale+ ZU11EG and is intended to be used in the portable system. Designed for industrial and defense applications, the TEB0912 has an extra rigid PCB and extended temperature grade.

Smart power management provides full control of power system and support battery power supply with PMBUS interface. Integrated DDR4 memory implement good resistance for shock and vibration stress.

 

Key Features

General

  • Platform - XCZU11EG-1FFVC1760I
  • Power Supply -  12V ± 5%
  • JTAG interface over one channel of FT2232
  • Configurable Boot mode
  • 8 separate configurable clock sources
  • Status LEDs - Power-Good, FPGA Done
  • DRAM DDR4, 2400, 4 GByte (PS connected)
  • DRAM DDR4, 2400, 4 GByte (PL connected)
  • 64 MByte Flash Memory 2 x QSPI NOR-Flash
  • 16 GTY transceivers
  • 32 GTH transceivers
  • 2 x 25 HPIO-pairs

Interfaces

  • 2 x 1 Gb Ethernet connectors
  • M.2 (E) slot for WiFi module
  • M.2 (M) slot for SSD module
  • MicroSD slot for SD2.0 (SDR104). SD3.0 functionality cannot be guaranteed
  • CAN
  • 2 x SMBUS connectors
  • 4 x FireFly GTY (copper/optical)
  • 4 x FireFly JESD204 ADC
  • 4 x FireFly JESD204 DAC
  • USB JTAG/UART
  • 4 x B2B connectors with 48 LVDS pairs

Board size

  • 180 mm × 120 mm

Scope of Delivery

  • 1 x TEB0912-03-ABI21-A Trenz Electronic MPSoC Multi-function Board with Xilinx Zynq UltraScale+ ZU11EG

產品編號：TEB0912-03-ABI21-A
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TE0807｜UltraSoM+ Series

TE0807 "UltraSoM+" Series-Xilinx Zynq UltraScale+, DDR4, Flash, 20 High Speed Serial Transceivers（ZU4CG - ZU7CG, ZU4EG - ZU7EG, ZU4EV - ZU7EV）

The Trenz Electronic TE0807 "UltraSoM+" Series is a powerful MPSoC module integrating a Xilinx Zynq UltraScale+ ZU4CG - ZU7CG, ZU4EG - ZU7EG, ZU4EV - ZU7EV， 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

 

Key Features

  • Xilinx Zynq UltraScale+ Series
  • ZU7EV 900 Pin Packages
  • 3 mm mounting holes for skyline heat spreader
  • Size: 52 x 76 mm
  • B2B Connectors: 4 x 160 pin
  • Rugged for shock and high vibration
  • 4 GByte DDR4 SDRAM
  • 128 MByte SPI Boot Flash (dual parallel)
  • User I/Os
    • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
    • Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
    • Transceiver clocks inputs and outputs
    • PLL clock generator inputs and outputs
  • Graphic Processing Unit (GPU) + Video codec unit (VCU)
  • Si5345 - 10 output PLL
  • All power supplies on board, single 3.3V Power required
    • 14 on-board DC/DC regulators and 13 LDOs
    • LP, FP, PL separately controlled power domains
  • Support for all boot modes (except NAND)
  • Support for any combination of PS connected peripherals
  • Evenly spread supply pins for good signal integrity

Scope of Delivery

  • 1 x TE0807-03-7DI21-A Trenz Electronic MPSoC Module with Xilinx Zynq UltraScale+ ZU07EV

  產品編號：

TE0807-03-7DI21-A：Xilinx Zynq UltraScale+ ZU7EV-1I

TE0807-03-7AI21-A：Xilinx Zynq UltraScale+ ZU7CG-1I

TE0807-03-7DE21-A：Xilinx Zynq UltraScale+ ZU7EV-1E

TE0807-03-4AI21-A：Xilinx Zynq UltraScale+ ZU4CG-1I

TE0807-03-4BE21-A：Xilinx Zynq UltraScale+ ZU4EG-1E

TE0807-03-4BE81-A：Xilinx Zynq UltraScale+ ZU4EG-1E

TE0807-03-7DI21-AZ：AMD Zynq™ UltraScale+™ ZU7EV-1I

TE0807-03-7DE21-AZ：AMD Zynq™ UltraScale+™ ZU7EV-1E
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  1. TE0808 ｜UltraSoM+ Series
  2. TE0728｜Xilinx Automotive Zynq-7020
  3. TE0726 ZynqBerry｜Xilinx Z-7007S Single-Core
  4. TE0726 ZynqBerry｜Xilinx Zynq-7010

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