Products with Xilinx FPGA

TE0711 Xilinx Artix-7:35T｜High IO Xilinx Artix-7 35T Module with speedgrade 2C and USB

The Trenz Electronic TE0711-01-35-2C is a FPGA module integrating a Xilinx Artix-7 35T, 32 MByte Quad SPI Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.

• Key Features

  • Xilinx Artix-7 XC7A35T-2CSG324C
  • Rugged for shock and high vibration
  • 32 MByte QSPI Flash memory
  • 100 MHz MEMS oscillator
  • Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (regular 4 mm)
  • 178 FPGA I/O's (84 differential pairs) available on board-to-board connectors
  • On-board high-efficiency DC-DC converters
    • 4.0 A x 1.0 V power rail
    • 1.0 A x 1.8 V power rail
    • 1.0 A x 1.5 V power rail
  • System management and power sequencing
  • eFUSE bit-stream encryption
  • AES bit-stream encryption
  • Four LEDs (three  freely used by user design, one system controller CPLD status LED)
  • FTDI FT2232H USB 2.0 High Speed to UART/FIFO
  • Evenly-spread supply pins for good signal integrity

Scope of Delivery

• 1 x TE0711-01-35-2C Trenz Electronic 4 x 5 cm  FPGA module with Xilinx Artix-7 35T
• 8 x screws
• 4 x bolts

MPSoC-Modul mit Xilinx Zynq UltraScale+ ZU4EV-1E，4 GByte DDR4，4 x 5,64 cm

The Trenz Electronic AM0010-02-4DE21MA is a MPSoC module integrating a Xilinx Zynq UltraScale+ ZU4EV, 4 GByte DDR4 SDRAM with ECC, 2 x 64 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

 Key Features

• Xilinx Zynq UltraScale+ XCZU4EV-1SFVC784E
  • ZU4EV, 784 Pin-Package
  • Application Processor: Quad-core Arm Cortex-A53 MPCore up to 1.5 GHz
  • Real-Time Processor: Dual-core Arm Cortex-R5 MPCore up to 600 MHz
• 4 GByte DDR4 SDRAM with ECC (PS)
• 2 x 64 MByte QSPI Flash
• 8 GByte e.MMC
• Serial EEPROM with EUI-48 Node Identity
• Plug-on module with 2 x 240-pin B2B connectors
• User I/Os
  • 204 SE
  • 102 DIFF GPIOs
  • Serial transceivers: 4 x PS-GTR, 4 x PL-GTH
• Gigabit Ethernet transceiver
• USB2.0 transceiver
• OPTIGA Trust M (Security controller)
• CryptoAuthentication Device
• Oscillator
• Analog Multiplexer
• Rugged for shock and high vibration
• Size: 4 x 5.64 cm
• Evenly-spread supply pins for good signal integrity

Scope of Delivery

• 1 x AM0010-02-4DE21MA Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU4EV
• 8 x screws
• 4 x bolts

TE0890-S7 Mini｜Fully Open-Source Module with Xilinx Spartan-7 7S25, 64 Mbit HyperRAM

The Trenz Electronic TE0890-01-P1C-5-A is a FPGA module integrating a Xilinx Spartan-7, 64 Mbit HyperRAM DRAM (may be used as video frame buffer), 64 Mbit Config PROM for dual-boot and/or SW code storage and dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os

The module is footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices.

Key Features

• Xilinx Spartan-7 XC7S25-1FTGB196C FPGA
• Dimensions: 2.7 x 5.2 cm
• Fully Open-Source Spartan-7 Module
• 7S25 target with 23K logic cells, 29K flops, 45 36Kb BRAMs, 80 mults.
• Footprint compatible with 7S6, 7S15, 7S50 FTGB-196 devices
• Devices fully supported by free "Web Pack" Vivado for Synthesis, Place + Route
• Dual-pinout DIP-40 or 50mil 80 pin connectors for 32 or 64 FPGA 3.3V I/Os
• 64 Mbit Config PROM for dual-boot and/or SW code storage
• 64 Mbit HyperRAM DRAM (may be used as video frame buffer)
• Standard 1x6 FTDI cable serial interface to Host-PCs
• Standard 1x6 Digilent HS2 JTAG header for initial PROM programming
• 5V supply input (4.0V-5.5V per PAM2305 spec)

Scope of Delivery

• 1 x TE0890-01-P1C-5-A Trenz Electronic FPGA module with Xilinx Spartan-7 

TE0830｜ MPSoC Module with Xilinx Zynq UltraScale+ ZU11EG-1I, COM HPC Standard(12 x 12cm)

The Trenz Electronic TE0830 is a COM-HPC compatible Zynq UltraScale+ module (12 x 12 cm). COM-HPC is the new PICMG-standard.

The TE0830 features high memory connectivity (PS up to 8 GByte and PL DDR up to 16 GByte) as well as fast Gigabit transceivers (up to 32.75 Gb/s) allowing PCIe Gen4 to be implemented as root complex or endpoint. Storage memory can be expanded as desired (SATA or M.2 PCIe storage card on carrier). In addition to these interfaces, USB, Gigabit Ethernet and several other common interfaces are available. The JTAG connection for programming the ZynqMP can be done via GPIO pins or conveniently via Ethernet (with current firmware), so that the use in the server area is also possible. TE0830 is currently under development, but an initial prototype has been fielded and functionality is currently being verified on the TEBT0830 test carrier. Expected release in Q3/Q4 2021 (with reservations).

Key Features (preliminary)

• SoC/FPGA (Zynq UltraScale+)
  • Package: FFVC1760
  • Device: ZU11 (assembly option ZU17, ZU19 possible*)
  • Engine: EG
  • Speed: -1 (assembly option, -2,-3*, ** possible)
  • Temperature: I (assembly option E, (Q, M) possible*,**)
• RAM/Storage
  • DDR4 (PS connected)
    • Data width: 72-bit with ECC
    • Size: 4 GByte (assembly option up to 8 GByte possible*)
    • Speed:***
  • DDR4 SODIMM (PL connected)
    • 72-bit DDR4 with ECC
    • Size: max 16 GByte*
    • Speed: NA*
  • e.MMC
    • Data width: 8-bit
    • Size: 64 GByte (max)
  • QSPI boot Flash in dual parallel mode
    • Data width: 8-bit
    • Size: 128 MByte (assembly up to 512 MByte possible*)
  • QDDRII
    • Size: 18 Mbit (assembly option possible*, default not assembled)
  • MAC address serial EEPROM with EUI-48™ node identity
• On Board
  • SC CPLD ans SoC
    • Intel MAX 10: 10M08
    • Xilinx Zynq-7000: XC7Z010 with 128 MByte QSPI and 512 MByte DDR3 (16-bit)
  • PLL SI5345
  • Gigabit ETH PHY
  • USB2 HUB
  • USB2 PHY
• Interface (2 x 400pin COM-HPC connectors)
  • 1 x PCIe SMB (ZynqMP PS GTR)
  • PCIe up to 48 lane (16 x GTY (32.75 Gb/s) and 32 x GTH (16.3 Gb/s))**
  • 1 x Gbit Ethernet
  • 4 x USB2
  • 1 x USB3 (ZynqMP PS GTR)
  • 1 x DDI (DP) (ZynqMP PS GTR)
  • 1 x SATA (ZynqMP PS GTR)
  • 1 x SPI
  • 1 x I2C SMB
  • 3 x I2C
  • 2 x UART (1x ZynqMP, 1x SC Zynq)
  • 12 x GPIO (JTAG over GPIO)
  • PL HP IOs  x32 (15 diff) over COM-HPC CSI interface
• Power
  • 12V main
  • 5V standby
  • 2.0-3.3V RTC
• Dimension
  • COM-HPC client module size B (120 x 120 mm)

Notes
* depends on assembly version
** not all combinations are possible
*** depends on used Zynq UltraScale+ and DDR4 combination
**** uses is limited by Zynq UltraScale+ specification