TE0823－MPSoC Module with Xilinx Zynq UltraScale+ 3CG-L1I, 1 GByte LPDDR4, 4 x 5 cm, LP

The Trenz Electronic TE0823-01-3PIU1ML is an industrial-grade MPSoC module integrating a low power Xilinx Zynq UltraScale+ ZU3CG, 1 GByte LPDDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

Key Features

General

• Rugged for shock and high vibration
• Evenly spread supply pins for good signal integrity
• Plug-on module with 2 x 100 pin and 1 x 60 pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (low profile, 2,5 mm)

SoC/FPGA

• Xilinx Zynq UltraScale+ XCZU3CG-L1SFVC784I (Low Power)
  • Application Processor: Dual-core ARM Cortex-A53 MPCore
  • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
• Package: SFVC784
• Device: ZU3
• Engine: CG
• Speed: -1LI (also non-low power assembly options possible)
• Temperature range: industrial

RAM/Storage

• Low power DDR4 on PS with 32 bit data width
• 128 MByte QSPI boot Flash in dual parallel mode
• 8 GByte e.MMC memory with 8 bit data width
• MAC address serial EEPROM with EUI-48 node identity

On Board

• Lattice LCMXO2
• PLL SI5338
• Gigabit Ethernet transceiver PHY
• Hi-speed USB2 ULPI transceiver with full OTG support

Interface

• 132 x HP PL I/Os (3 banks)
• ETH
• USB
• 4 GTR (for USB3, SATA, PCIe, DP)
  Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
  • PCI Express interface version 2.1 compliant
  • SATA 3.1 specification compliant interface

  • DisplayPort source-only interface with video resolution up to 4k x 2k

  • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
  • 1 GB/s serial GMII interface
• 14 x PS MIOs
  • MIO for UART
  • thereof 6 MIO for SD card interface (default configuration)
  • MIO for PJTAG
• JTAG
• Ctrl

Power

• 3.3V-5V main input
• 3.3V controller input
• Variable bank I/O power input
• All power supplies on board

Dimension

• 4 x 5 cm form factor

Scope of Delivery

• 1 x TE0823-01-3PIU1ML Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU3CG (low power) and low profile socket strips

TE0820-MPSoC Module with Xilinx Zynq UltraScale+ ZU2EG-1I, 2 GByte DDR4, 4 x 5 cm, LP(ZU2EG,ZU3EG)

The Trenz Electronic TE0820 Xilinx Zynq UltraScale+ Series is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ ZU2EG,ZU3EG, 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

Key Features

• Xilinx Zynq UltraScale+ Series
• ZU2EG, 784 Pin Packages
  • Application Processor: Quad-Core ARM Cortex-A53 MPCore
  • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
  • Graphics Processor: Mali-400 MP2
  • Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
    • PCI Express interface version 2.1 compliant
    • SATA 3.1 specification compliant interface

    • DisplayPort source-only interface with video resolution up to 4k x 2k

    • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
    • 1 GB/s serial GMII interface
  • 132 x HP PL I/Os (3 banks)
  • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
  • 4 x serial PS GTR transceivers
• Rugged for shock and high vibration
• Graphic Processing Unit (GPU)
• Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (low profile, 2.5 mm)
• 2 GByte DDR4 SDRAM, 32-Bit databus-width
• 128 MByte QSPI boot Flash in dual parallel mode
• 8 GByte e.MMC Memory (up to 64 GByte)
• Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
• Gigabit Ethernet transceiver PHY
• MAC address serial EEPROM with EUI-48 node identity
• Hi-speed USB2 ULPI transceiver with full OTG support
• All power supplies on board
• Evenly spread supply pins for good signal integrity
• 4 x 5 cm form factor

Scope of Delivery

• 1 x TE0820-05-2BI21ML Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU2EG, low profile connectors (2.5 mm)

TE0820-MPSoC Module with Xilinx Zynq UltraScale+ ZU2CG-1E, 2 GByte DDR4 SDRAM, 4 x 5 cm（ZU2CG - ZU5CG, ZU2EG - ZU5EG, ZU4EV, ZU5EV）

The Trenz Electronic TE0820 Series is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ ZU2CG - ZU5CG, ZU2EG - ZU5EG, ZU4EV, ZU5EV, 2 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint, smaller than a credit card, at the most competitive price. Modules in 4 x 5 cm form factor are fully mechanically and largely electrically compatible among each other.

Key Features

• Xilinx Zynq UltraScale+ Series
  • 784 Pin Packages
  • Application Processor: Dual-core ARM Cortex-A53 MPCore
  • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
  • Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
    • PCI Express interface version 2.1 compliant
    • SATA 3.1 specification compliant interface

    • DisplayPort source-only interface with video resolution up to 4k x 2k

    • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
    • 1 GB/s serial GMII interface
  • 132 x HP PL I/Os (3 banks)
  • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
  • 4 x serial PS GTR transceivers
• Rugged for shock and high vibration
• Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (regular 4 mm)
• 2 GByte DDR4 SDRAM, 32-Bit databus-width
• 128 MByte QSPI boot Flash in dual parallel mode
• 8 GByte e.MMC Memory (up to 64 GByte)
• Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
• Gigabit Ethernet transceiver PHY
• MAC address serial EEPROM with EUI-48 node identity
• Hi-speed USB2 ULPI transceiver with full OTG support
• All power supplies on board
• Evenly spread supply pins for good signal integrity
• 4 x 5 cm form factor

Scope of Delivery

• 1 x TE0820-05-2AE21MA Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU2CG
• 8 x screws
• 4 x bolts

TE0821-Xilinx Zynq UltraScale+, DDR4, Flash, USB, Ethernet, e.MMC, 96 High Density PL I/Os（ZU2CG - ZU5CG, ZU2EG - ZU5EG, ZU4EV, ZU5EV）

The Trenz Electronic TE0821 Series is an industrial-grade MPSoC module integrating a Xilinx Zynq UltraScale+ ZU2CG - ZU5CG, ZU2EG - ZU5EG, ZU4EV, ZU5EV, 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 64 GByte e.MMC memory, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections.

This module is pin compatible with Trenz Electronic TE0820 MPSoC modules (JM2 pin 100 is not connected).

Key Features

• Xilinx Zynq UltraScale+ Series
• ZU2CG, 784 Pin Packages
  • Application Processor: Dual-Core ARM Cortex-A53 MPCore
  • Real-Time Processor: Dual-core ARM Cortex-R5 MPCore
  • Four high-speed serial I/O (HSSIO) interfaces supporting following protocols:
    • PCI Express interface version 2.1 compliant
    • SATA 3.1 specification compliant interface

    • DisplayPort source-only interface with video resolution up to 4k x 2k

    • USB 3.0 specification compliant interface implementing a 5 Gbit/s line rate
    • 1 GB/s serial GMII interface
  • 34 x High Performance und 96 x High Density PL I/Os
  • 14 x PS MIOs (6 of the MIOs intended for SD card interface in default configuration)
  • 4 x serial PS GTR transceivers
• Rugged for shock and high vibration
• Plug-on module with 2 x 100-pin and 1 x 60-pin Razor Beam High-Speed hermaphroditic Terminal/Socket Strips (regular 4 mm)
• 4 GByte DDR4 SDRAM, 32-Bit databus-width
• 128 MByte QSPI boot Flash in dual parallel mode
• 64 GByte e.MMC Memory
• Programmable quad PLL clock generator PLL for PS GTR clocks (optional external reference)
• Gigabit Ethernet transceiver PHY
• MAC address serial EEPROM with EUI-48 node identity
• Hi-speed USB2 ULPI transceiver with full OTG support
• All power supplies on board
• Evenly spread supply pins for good signal integrity
• size: 4 x 5 cm

Scope of Delivery

• 1 x TE0821-01-2AE31PA Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU2CG
• 8 x screws
• 4 x bolts