TEB0911－UltraRack+ MPSoC Board with Xilinx Zynq UltraScale+ ZU9,6 FMC Connectors
The Trenz Electronic TEB0911 UltraRack+ board is integrating a Xilinx Zynq UltraScale+ ZU9EG MPSoC with 2 x 64 MByte Flash memory for configuration and operation, 8 GByte DDR4-SDRAM SO-DIMM socket with 64-bit wide data bus, 22 MGT lanes and powerful switch-mode power supplies for all on-board voltages. The TEB0911 board exposes the pins of the Zynq MPSoC to accessible connectors and provides a whole range of on-board components to test and evaluate the Zynq UltraScale+ MPSoC and for developing purposes. The board is capable to be fitted to a enclosure, whereby on the enclosure's rear and front panel, I/O's, LVDS-pairs and MGT lanes are accessible through 6 on-board FMC connectors and other standard high-speed interfaces, namely USB3, SFP+, SSD, GbE, etc.
Key Features
- Zynq UltraScale+ MPSoC XCZU9EG-1FFVB1156E
- 1156 Pin Package
- 8 GByte 64-Bit DDR4 SO-DIMM (PS connected)
- Active heat sink (serial number 638088 and above)
- M2 PCIe SSD (1-Lane)
- 8 GByte e.MMC (bootable)
- 2 x 64 MByte Dual QSPI Flash (bootable)
- System Controller(LCMXO2-7000HC)
- Power Sequencing
- IO Expander
- Configurable PLLs
- GTH/GTP Reference CLKs
Front Panel
- 4 x FMC
- 4 GTH per FMC
- 68 ZynqMP PL IO per FMC
- DisplayPort (2-Lanes)
- RJ34 ETH + Dual USB3 Combo
- Dual Stack SFP+
- SD (bootable)
- Status LEDs
Back Panel
- 2 x FMC
- 4/2 GTH
- 12 ZynqMP PL IO per FMC
- 56 SC IO per FMC
- USB JTAG/UART ZynqMP
- USB JTAG/GPIO FMC
- CAN FD (DB9 Connector)
- SMA (external CLK)
- 5-pin 24 V power connector
Board size
- 406 mm × 234.30 mm, please download the assembly diagram for exact details
Scope of Delivery
- 1 x TEB0911-04-9BEX1MA Trenz Electronic UltraRack+ MPSoC board with Xilinx Zynq UltraScale+ ZU9EG
- 1 x active heat sink, pre-assembled
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產品編號：TEB0911-04-9BEX1MA |
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