TE0808 |UltraSoM+ Series
TE0808 "UltraSoM+" Series-Xilinx Zynq UltraScale+, DDR4, Flash, 20 High Speed Serial Transceivers(ZU6CG, ZU9CG, ZU6EG, ZU9EG, ZU15EG)
All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.
Key Features
- Xilinx Zynq UltraSoM+ Series
- ZU9EG 900 Pin Packages
- 3 mm mounting holes for skyline heat spreader
- Size: 52 x 76 mm
- B2B Connectors: 4 x 160 pin
- Rugged for shock and high vibration
- 4 GByte DDR4 SDRAM, 64-Bit width
- 128 MByte SPI Boot Flash (dual parallel)
- User I/Os
- 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
- Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
- Transceiver clocks inputs and outputs
- PLL clock generator inputs and outputs
- Si5345 - 10 output PLL
- All power supplies on board, single 3.3V Power required
- 14 on-board DC/DC regulators and 13 LDOs
- LP, FP, PL separately controlled power domains
- Support for all boot modes (except NAND) and scenarios
- Support for any combination of PS connected peripherals
- Evenly spread supply pins for good signal integrity
Scope of Delivery
- 1 x TE0808-05-9BE21-L Trenz Electronic MPSoC module with Xilinx Zynq UltraScale+ ZU9EG, low profile
產品編號: TE0808-05-9BE21-L:Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GB DDR4, LP TE0808-05-9BE21-LZ:Zynq UltraSOM+ MPSoC Module with AMD Zynq™ UltraScale+™ ZU9EG-1E, 4 GB DDR4, LP TE0808-05-6BE21-L:Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GB DDR4, LP TE0808-05-6BE21-A:Zynq UltraScale+ XCZU6EG-1FFVC900E, 4 GB DDR4 TE0808-05-9BE21-A:Zynq UltraScale+ XCZU9EG-1FFVC900E, 4 GByte DDR4 TE0808-05-9GI21-A:Zynq UltraScale+ XCZU9EG-2FFVC900I, 4 GB DDR4 TE0808-05-BBE21-A:Zynq UltraScale+ XCZU15EG-1FFVC900E, 4 GB DDR4 TE0808-05-BBE21-AZ:AMD Zynq™ UltraScale+™ ZU15EG-1E, 4 GB DDR4 |
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