TE0807 "UltraSoM+" Series-Xilinx Zynq UltraScale+, DDR4, Flash, 20 High Speed Serial Transceivers（ZU4CG - ZU7CG, ZU4EG - ZU7EG, ZU4EV - ZU7EV）

The Trenz Electronic TE0807 "UltraSoM+" Series is a powerful MPSoC module integrating a Xilinx Zynq UltraScale+ ZU4CG - ZU7CG, ZU4EG - ZU7EG, ZU4EV - ZU7EV， 4 GByte DDR4 SDRAM, 128 MByte Flash memory for configuration and operation, 20 x high speed serial transceivers, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking connections. 

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

Key Features

• Xilinx Zynq UltraScale+ Series
• ZU7EV 900 Pin Packages
• 3 mm mounting holes for skyline heat spreader
• Size: 52 x 76 mm
• B2B Connectors: 4 x 160 pin
• Rugged for shock and high vibration
• 4 GByte DDR4 SDRAM
• 128 MByte SPI Boot Flash (dual parallel)
• User I/Os
  • 65 x PS MIOs, 48 x PL HD GPIOs, 156 x PL HP GIPIOs (3 banks)
  • Serial transceivers: 4 x PS-GTR, 16 x PL-GTH
  • Transceiver clocks inputs and outputs
  • PLL clock generator inputs and outputs
• Graphic Processing Unit (GPU) + Video codec unit (VCU)
• Si5345 - 10 output PLL
• All power supplies on board, single 3.3V Power required
  • 14 on-board DC/DC regulators and 13 LDOs
  • LP, FP, PL separately controlled power domains
• Support for all boot modes (except NAND)
• Support for any combination of PS connected peripherals
• Evenly spread supply pins for good signal integrity

Scope of Delivery

• 1 x TE0807-03-7DI21-A Trenz Electronic MPSoC Module with Xilinx Zynq UltraScale+ ZU07EV

TEF0007-FMC Card with DisplayPort input and output

Key Features

• Xilinx Kintex-7 FPGA XC7K160T-2FBG676C
• 32 MByte QSPI Flash
• Clock management
  • 50 MHz oscillator
  • Configurable PLL (SI5345) for MGT reference clocks (DP and FMC MGTs) and additional system clocks
• Displayport
  • Sink: up to 4 lanes over SN65DP159
  • Source: up to 4 lanes over SN75DP130
  • Important Note: Xilinx DP IP or other compatible third party IP is needed
• FMC LPC compatible with one MGT RX/TX lane
  • 34 differential IOs (68 single ended)
  • 1 MGT on LPC or up to 4 MGT on HPC
  • FPGA JTAG (optional over separate XSR connector possible)
  • FMC EEPROM (not configured)

Scope of Delivery

• 1 x TEF0007-02A Trenz Electronic FMC card with pre-assembled heat sink
• 1 x Front panel with fixing material (screws, nuts and spacer sleeves)

TEC0089-DesignWare ARC EM Software Development Platform

Key Features

• Xilinx Kintex-7 XC7K325T-2FBG676C
• 32 MByte Quad-SPI Flash memory (for configuration and operation)
• USB-JTAG bridge FT2232H
• FPGA configuration through:
  • JTAG
  • SPI Flash memory
• SPI Flash configuration through:
  • JTAG
  • USB
• Connectors
  • Arduino compatible pin headers
  • MicroBUS compatible pin headers
  • 3x Pmod compatible pin headers
  • 50 pin header 2.54mm (40 single-ended IO, 20 differential lanes, variable VCCIO)
  • Mictor Debug connector
  • 10 pin Debug connector 2mm
• 2 x 8 MByte PSRAM IS66WVC4M16EALL
• 32 MByte User Quad-SPI Flash memory
• Micro SDcard Socket
• 3-axis gyroscope, 3-axis accelerometer, 3-axis magnetometer ICM-20948
• Stereo Audio Codec MAX9880A
• 2 x PDM Microphones SPK0641HT4H-1
• 2 x 3.5mm RCA audio jacks (input/output)
• 100MHz User Clock Oscillator SiT8008
• Status LEDs, Power LED
  • 8 x User LEDs
  • Reset Buttons
  • User Button
  • 2 x 4bit User DIP switches
• 12V Power Supply (separately included in the scope of delivery)

Scope of Delivery

The ARC EM Software Development hardware consists of:

• 1 x ARC EM SDP (hardware) board
• 1 x 12V Interchangeable Plug with four adapters and cable
• 4 x bolts and screws

TE0729－SoC Module with Xilinx Zynq-7020, 512 MByte DDR3L SDRAM, 3 x Ethernet

The Trenz Electronic TE0729 is an industrial-grade SoC module integrating a Xilinx Zynq-7020 with a Gigabit Ethernet transceiver, 2 x 100 Mbit Ethernet, 512 MByte DDR3L SDRAM, 32 MByte Flash memory for configuration and operation, and powerful switch-mode power supplies for all on-board voltages. A large number of configurable I/O's is provided via rugged high-speed stacking strips.

All this on a tiny footprint of 5.2 x 7.6 cm at the most competitive price. These high-density integrated modules are smaller than a credit card and available in several variants.

Key Features

• Zynq XC7Z020-2CLG484I
• Rugged for shock and high vibration
• Equipped with sulfur resistant resistors
• Evenly-spread supply pins for good signal integrity
• 3 mm mounting holes for Skyline heat spreader
• 2 x ARM Cortex-A9
• 1 x 10/100/1000 Mbps Ethernet transceiver PHY
• 2 x 10/100 Mbps Ethernet transceiver PHYs
• 3 x MAC-Address EEPROMs
• 512 MByte (16-bit) DDR3 SDRAM
• 32 MByte QSPI-Flash memory
• 8 GByte e.MMC memory
• USB 2.0 high-speed ULPI transceiver
• Plug-on module with 2 x 120-pin high-speed hermaphroditic strips
• 136 FPGA I/O's (58 LVDS pairs possible) and 6 PS MIO's available on board-to-board connectors
• On-board high-efficiency DC-DC converters
  • 4.0 A x 1.0V power rail
  • 1.5 A x 1.5V power rail
  • 1.5 A x 1.8V power rail
  • 1.5 A x 2.5V power rail
• System management
• eFUSE bit-stream encryption
• AES bit-stream encryption
• Temperature compensated RTC (real-time clock)
• User LED
• size: 5.2 x 7.6 cm
• Cooling Solution available

Scope of Delivery

• 1 x TE0729-02-62I63MA Trenz Electronic SoC module with Xilinx Zynq-7020